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Abstract
The standard transmitter employed for aero-space mission at microwave frequencies need extensive optimization and takes higher turnaround time due to manual tuning and soldering of components. The discrete high power transistor for the output power having varied perform due to batch to batch parameter variations. This makes low throughput due to device limitation and needs extensive tuning approach. Further the weight of the housing and its realization is time consuming process due to standard machining and tuning requirements. In this article, we proposed variety of new approaches to achieve light weight, higher throughput while maintaining reliability without much manual intervention. This article details SMT based approach for RF circuits, CFRP based housing using 3-D printing techniques and GaN device to achieve high output power. Gold plating of the CFRP, realization of circuits on plated CFRP carrier plates, thermal characterization and usage of SMT line for RF circuits are the other areas dwelt in this article. The integration of these techniques may lead to highly reliable RF system while maintaining the stringent specifications for aerospace applications. Structural analysis of CFRP, thermal imaging of high power devices, SMT process steps are further detailed.
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References
- Pozar, D. M., "Microwave Engineering", John Wiley and Sons, 2012.
- Marco Lisi and Tommaso Ghindi., "Additive manufacturing enables microwave components for space applications", Microwaves and RF, June 2018.
- Singh, K., Kansara, H. R., Nirmal, A. V. and Sharma, S. V., "Microwave Circuit Characterization on Carbon Fibre (CFRP) Based Carrier Plates", 2nd IEEEICPEICES, Delhi, 2018.
- Satisha, M. et al., "Challenges in SMT Process for RF Cards and its Mitigation Techniques", Vol.31, No.2, 2020, pp.10-15JST.
- Sangam, et al., "Realization of Compact CW Based X-Band Power Amplifier using GaN Device for Data Transmitter Applications", IMARC, Indian Institute of Technology Kanpur, November 2021.
- Mericanin, A. B., Dannjanovic, M. S. and Zivanov, L. D., "RF Equivalent Circuit Modelling of Surface Mounted Components for PCB Applications", Microelectronics International, May 2010. Besra, S. S. et al., "Failure Diagnosis in RF boards and Mitigation Techniques", CONIAPS XXVI, December 18-20, 2020.
- Sanjeev, et al., "Body Grounding of RF Devices Using Indium Alloy2 for Flight Applications", Journal of Spacecraft Technology, Vol.30, No.2, July- Dec. 2019, pp.25-31.
- Kamaljeet Singh., Dinesh., Nirmal, A. V. and Sharma, S. V., "Miniaturization and Packaging Concept in Power Amplifier Using GaN Device for Space Applications", JETR-2017, Vol.5, pp.10-19.
References
Pozar, D. M., "Microwave Engineering", John Wiley and Sons, 2012.
Marco Lisi and Tommaso Ghindi., "Additive manufacturing enables microwave components for space applications", Microwaves and RF, June 2018.
Singh, K., Kansara, H. R., Nirmal, A. V. and Sharma, S. V., "Microwave Circuit Characterization on Carbon Fibre (CFRP) Based Carrier Plates", 2nd IEEEICPEICES, Delhi, 2018.
Satisha, M. et al., "Challenges in SMT Process for RF Cards and its Mitigation Techniques", Vol.31, No.2, 2020, pp.10-15JST.
Sangam, et al., "Realization of Compact CW Based X-Band Power Amplifier using GaN Device for Data Transmitter Applications", IMARC, Indian Institute of Technology Kanpur, November 2021.
Mericanin, A. B., Dannjanovic, M. S. and Zivanov, L. D., "RF Equivalent Circuit Modelling of Surface Mounted Components for PCB Applications", Microelectronics International, May 2010. Besra, S. S. et al., "Failure Diagnosis in RF boards and Mitigation Techniques", CONIAPS XXVI, December 18-20, 2020.
Sanjeev, et al., "Body Grounding of RF Devices Using Indium Alloy2 for Flight Applications", Journal of Spacecraft Technology, Vol.30, No.2, July- Dec. 2019, pp.25-31.
Kamaljeet Singh., Dinesh., Nirmal, A. V. and Sharma, S. V., "Miniaturization and Packaging Concept in Power Amplifier Using GaN Device for Space Applications", JETR-2017, Vol.5, pp.10-19.