Main Article Content
Abstract
DC-DC converter is an important electronic component in any aerospace system employed in many sub-systems. Hybrid technology based DC-DC Converters provide compactness, better reliability and performance compared to standard SMT converters. Technology advancements leads to miniaturization of the module and poses technical challenges due to involvement of huge numbers of die components, transformers, inductors, capacitors and other challenges associated with combination of multiple process and critical fabrication technology involved for hybrid realization of aconverter. Various other challenges due to compactness achieved through hybridization in various domain such as layout, managing thermal aspects of components, package selection, testing and reliability additionally brings many constraints in the realization. Layout design poses several constraints to achieve desired electrical and thermal performance meeting various design guidelines apart from reliability criteria towards realizing a compact, reliable and reproducible product. This article details the special fabrication techniques adopted for miniaturization of hybrid converters andvariousfabrication as well as process challenges encountered apart from effective methodologies adopted to mitigate various stresses resulting in thereproducible production. Details of special subassemblies, attachment techniques and their impact in realization are presented. Techniques and procedures to mitigate the challenges resulted in the qualification of the product are also presented in this article.
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References
- Licari James, J and Leonard R. Enlow., "Hybrid Microcircuit Technology Hand Book", 2nd Edition, Noyes Publications, USA.
- Performance Specification for Hybrid Microcircuits - MIL-PRF-38534F, 2006.
- David, R. F., "Manufacturing Power Hybrid Circuits", Electronics Packaging and Production, March 1996.
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- Son Ha Tran., Laurent Dupont and Zoubir Khatir., "Solder Void Position and Size Effects on Electro Thermal Behaviour of MOSFET Transistors in Forward Bias Conditions", Microelectronics Reliability, Vol.54, Issues 9-10, 2014, pp.1921-1926.
- Xingcun Colin Tong., "Advanced Materials for Thermal Management of Electronic Packaging", Ch.8, pp. 305-370, 2011, Springer New York.
- Al. Krum., Electronic Packaging and Interconnection Handbook, Chapter 2, C.A. Harper (Ed.), McGraw- Hill, New York, 2000.
- Sergent, J. E. and Al. Krum., Thermal Management Handbook for Electronic Assemblies, Electronic Packaging and Interconnection Series, McGraw- Hill, New York, 1998.
- King, J. A., Materials Handbook for Hybrid Microelectronics, Artech House, 1988.
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References
Licari James, J and Leonard R. Enlow., "Hybrid Microcircuit Technology Hand Book", 2nd Edition, Noyes Publications, USA.
Performance Specification for Hybrid Microcircuits - MIL-PRF-38534F, 2006.
David, R. F., "Manufacturing Power Hybrid Circuits", Electronics Packaging and Production, March 1996.
Divya, B. S, et.al., "Dice Selection in Hybrid Microcircuits for Aerospace Applications", Journal Of Aerospace Sciences and Technologies, Vol.73, No.3, August 2021.
Anju Singh., "Thick Film Technology based DC-DC Converter Hybrid for Space Applications", ICEECCOT IEEE, December 2021.
Anju Singh., "Novel Process for Miniature Low Dropout Voltage Regulator Hybrid for Aerospace Applications", 2nd Global Conference for Advancement in Technology (GCAT), Bangalore, India, October 1-3, 2021.
Raghuraman, A., Ramakrishnan, D., Pushpa Naresh Kumar., Kanthimathinathan, T. and Arun Batra., "Thermal Resistance of Power Devices in Hybrid Microcircuits", IINC, 2004.
Son Ha Tran., Laurent Dupont and Zoubir Khatir., "Solder Void Position and Size Effects on Electro Thermal Behaviour of MOSFET Transistors in Forward Bias Conditions", Microelectronics Reliability, Vol.54, Issues 9-10, 2014, pp.1921-1926.
Xingcun Colin Tong., "Advanced Materials for Thermal Management of Electronic Packaging", Ch.8, pp. 305-370, 2011, Springer New York.
Al. Krum., Electronic Packaging and Interconnection Handbook, Chapter 2, C.A. Harper (Ed.), McGraw- Hill, New York, 2000.
Sergent, J. E. and Al. Krum., Thermal Management Handbook for Electronic Assemblies, Electronic Packaging and Interconnection Series, McGraw- Hill, New York, 1998.
King, J. A., Materials Handbook for Hybrid Microelectronics, Artech House, 1988.
Material Safety Data Sheet acc. To ISO/DIS 11014, Master Bond Inc., Adhesives, Sealants and Coatings, 154, Hobart Street, Hackensack, NJ 07601-3922. http://www.masterbond.com
One and Two-part Silicone Elastomers for Aerospace Applications - Silicones for Aerospace Dow Corning Ò Space-Grade, Silicone Sealants, N.V. Dow Corning Parc Industriél, Zone C B-7180 Senette Belgium. http:// www.dowcorning.com