Main Article Content
Abstract
Hybrid Microcircuits (HMCs) which bring about miniaturization with better performance and reliability are ideally suited for specific application where low volume requirement needed for aerospace missions. A large number of HMCs for varied applications are used in aerospace industry. HMCs generally use passive components and interconnections in thick film form, and active devices (MOSFETs, Transistor and Diode dice) and monolithic ICs (as bare chips) bonded to a substrate and are employed to carry out multiple functions. The die and other chip components utilized in making HMCs necessitated usage of hermetic sealing. The resulting HMCs consisting of multiple components are used as standalone EEE component. A general guideline of using HMCs for 9 years and re-screening after 3 years result in lot of constraint on resources and not viable in present scenario. The study conducted to find out the criticality and testing methodology for the extension of usable storage period. Comprehensive test plan consisting of variety of HMCs having varied processes, materials, density and various tests conducted as per the plan. This article details the various plans, choice of HMCs, testing results and analysis for the basis of extending the usable storage period of the HMCs for aerospace industry.
Keywords
Article Details
References
- "Test Methods for Microelectronic Devices", MILSTD- 883.
- "Storage and Retest Plan for EEE Parts, Satellite Subsystems and Satellite", SRG/RAED/Storage plan October 2010.
- Slowik, B. R. and Madison, J. A., "Evaluation of an Effective Screening Approach for Multichip Hybrid Packages Applicable to a High Reliability Program".
- James D. Branum., "Selection and Evaluation of Environmental Screening Tests for Trident I (C4) Electronics Black Boxes", Lockheed Missiles and Space Company Inc.
- James J. Licari and Leonard R. Enlow., "Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production", 2nd Edition, Noyes Publications, New Jersey, 1998.
- Dash, S. K., Janardana, A. S., Krishna Raju, V., Venkatesh, K. and Nanjunda Swamy, T. S., "Component Failure Trend Analysis and their Implication in Improving the Overall System Reliability".
- Winokur, P. S., Shaneyfelt, M. R., Meisenheimer, T. L. and Fleetwood, D. M., "Advanced Qualification Techniques", IEEE Transactions on Nuclear Science, Vol.41, No.3, June 1994, pp.538-548.
- Edward B. Haki., "Advancements in Complex Microcircuit Qualification-QM", Solid State Technology, May 1998, pp.98-100.
References
"Test Methods for Microelectronic Devices", MILSTD- 883.
"Storage and Retest Plan for EEE Parts, Satellite Subsystems and Satellite", SRG/RAED/Storage plan October 2010.
Slowik, B. R. and Madison, J. A., "Evaluation of an Effective Screening Approach for Multichip Hybrid Packages Applicable to a High Reliability Program".
James D. Branum., "Selection and Evaluation of Environmental Screening Tests for Trident I (C4) Electronics Black Boxes", Lockheed Missiles and Space Company Inc.
James J. Licari and Leonard R. Enlow., "Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production", 2nd Edition, Noyes Publications, New Jersey, 1998.
Dash, S. K., Janardana, A. S., Krishna Raju, V., Venkatesh, K. and Nanjunda Swamy, T. S., "Component Failure Trend Analysis and their Implication in Improving the Overall System Reliability".
Winokur, P. S., Shaneyfelt, M. R., Meisenheimer, T. L. and Fleetwood, D. M., "Advanced Qualification Techniques", IEEE Transactions on Nuclear Science, Vol.41, No.3, June 1994, pp.538-548.
Edward B. Haki., "Advancements in Complex Microcircuit Qualification-QM", Solid State Technology, May 1998, pp.98-100.