Main Article Content

Abstract

Wire bonding is one of the major as well as critical processes in the realization of Hybrid microcircuits (HMCs), Microwave Integrated Circuits (MICs) and Monolithic Microwave Integrated Circuits (MMIC) where fine gold or aluminum wires are used. Selection of fine wires in wire bonding depends upon the requirement of current carrying capability of the circuit and process feasibility. This article details the experimental study and analysis of wire bonds having various diameter, length as well as thermal effects. The effect of substrate also investigated taking into Alumina (96% and 99.6%) and Aluminium Nitride apart from effect of metallisation methodology encompassing sputtering and thick film screen-printed gold.

Keywords

Fusing Current, Hybrid Microcircuit, Interconnection, Wire Bond

Article Details

How to Cite
Ashok, K., Behera, R., Lonkadi, S. S., Andhiwal, A., & Singh, K. (2023). Fusing Current Characterization of AU Wire Bonds for Hybrid Microcircuits in Aerospace Environment. Journal of Aerospace Sciences and Technologies, 75(4), 415–425. Retrieved from http://joast.org/index.php/joast/article/view/913

References

  1. Jianbiao Pan, P.H.D., "Wire Bonding Challenges in Optoelectronics Packaging", California Polytechnic State University San Luis Obispo, California, Patrice Fraud Npos Consulting Los Angeles, California, 2004.
  2. Krabbenborg, B., "High Current Bond Design Rules Based on Bond Pad Degradation and Fusing of the Wire", Microelectronics Reliability, Vol.39, No.1, pp.77-88, 1999.
  3. Preece, W. H., "On the Heating Effects of Electric Currents", Proceedings of the Royal Society of London, Vol.36, 464, 1884.
  4. Kenneth C. Chen., Larry K. Warne., Yau T. Lin., Robert L. Kinzel, Johnathon D. Huff., Michael B. McLean., Mark W. Jenkins and Brian M. Rutherford., "Conductor Fusing and Gapping for Bond Wires", Sandia National Laboratories, P.O.Box 5800, Albuquerque, NM 87185, USA, 2013.
  5. Jonathon D. Huff., Michael B. McLean., Mark W. Jenkins and Brian M. Rutherford., "1 Mil Gold Bond Wire Study", Sandia Report, Sand2013-3715, Printed May 2013.
  6. Jithesh shah., "Estimating Bond Wire Current-carrying Capacity", www.power sysytem design.com, 2012.
  7. Chen Kenneth, C and Brigham William, P., "EBW Gapping Study", Sand2001-0698, Sandia National Laboratories, Albuquerque, NM, March 2001.
  8. Chen Kenneth C., Tom (T) Y. Lin and Larry K. Warne., "Bond Wire and Bridge-wire Fusing", Sand2011-1658, Sandia National Laboratories, Albuquerque, NM, March 2011.
  9. Richard Brown., "RF/Microwave Hybrids", Basics, Materials and Processes, Richard Brown Associates, Inc., 2013.
  10. James J. Licari and Leonard, R., Hybrid Microcircuit Technology Handbook by Enlow, 3rd Edition Noyes Publication, 1988.
  11. Loh Eugene., "Physical Analyses for Data on Fused- Open Bond Wires", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.6, No.2, pp.209-217, 1983.
  12. Mertol Atila., "Estimation of Aluminum and Gold Bond Wire Fusing Current and Fusing Time", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.18, No.1, pp.210-214, 1995.
  13. Peck, D., "Gold Fine Wire Bonding", SS289361, Sandia National Laboratories, September 1994.