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Wire bonding is one of the major as well as critical processes in the realization of Hybrid microcircuits (HMCs), Microwave Integrated Circuits (MICs) and Monolithic Microwave Integrated Circuits (MMIC) where fine gold or aluminum wires are used. Selection of fine wires in wire bonding depends upon the requirement of current carrying capability of the circuit and process feasibility. This article details the experimental study and analysis of wire bonds having various diameter, length as well as thermal effects. The effect of substrate also investigated taking into Alumina (96% and 99.6%) and Aluminium Nitride apart from effect of metallisation methodology encompassing sputtering and thick film screen-printed gold.


Fusing Current, Hybrid Microcircuit, Interconnection, Wire Bond

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How to Cite
Ashok, K., Behera, R., Lonkadi, S. S., Andhiwal, A., & Singh, K. (2023). Fusing Current Characterization of AU Wire Bonds for Hybrid Microcircuits in Aerospace Environment. Journal of Aerospace Sciences and Technologies, 75(4), 415–425. Retrieved from


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